1. 2. 3. material content data sheet sales product name bsp772t issued 29. august 2013 ma# MA001070980 package pg-dso-8-24 weight* 83.54 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.222 3.86 3.86 38569 38569 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 107 non noble metal zinc 7440-66-6 0.036 0.04 429 non noble metal iron 7439-89-6 0.717 0.86 8585 non noble metal copper 7440-50-8 29.121 34.86 35.77 348596 357717 wire noble metal gold 7440-57-5 0.410 0.49 0.49 4904 4904 encapsulation organic material carbon black 1333-86-4 0.095 0.11 1139 plastics epoxy resin - 4.378 5.24 52409 inorganic material silicondioxide 60676-86-0 43.115 51.62 56.97 516115 569663 leadfinish non noble metal tin 7440-31-5 0.814 0.97 0.97 9742 9742 plating noble metal silver 7440-22-4 0.650 0.78 0.78 7784 7784 glue plastics epoxy resin - 0.170 0.20 2034 noble metal silver 7440-22-4 0.801 0.96 1.16 9587 11621 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
